Thermix THERMAL CONDUCTIVE ELASTOMERS

WE HAVE JUST THE MATERIAL FOR YOU

Heat is a by-product of faster processors and lost energy from Light Emitting Diodes (LED). Removing heat is a challenge today for engineers and thermal management designers. Having good and cost effective thermal management designs will make the difference between reliable and poor performing products.

Our range of thermal materials is specially formulated to resolve many of your thermal issues. The standard sheets are fiberglass reinforced to improve mechanical integrity. There is also the moldable Silicone grade where intricate 3D designs can be molded to custom fitting. The non-silicone range comes with a thin aluminum sheet.

THERMALLY CONDUCTIVE SILICONE

These products are designed to meet a wide range of thermal management requirements. Our Thermal Interface Silicone acts as an interface between hot surface and heat spreader, while its electrical insulative characteristic allows it to be applied to electronics components.

NON-SILICONE THERMAL CONDUCTIVE SHEETS

NSTC products are layers of laminated thermally conductive materials that enhance thermal conduction in all axes. The main purpose is to remove heat from a hot spot into the air. These layers are designed to remove heat up to 150W/mk in the X-Y plane. The total thickness is from 80 micron to 120 micron.

TECHNICAL DATASHEETS
Technical Datasheets are available upon request. Write to us at info@laminarlabs.com for other thickness range or any specific recommendations. You can also log in to our eCatalogue for more information

Fiberglass Reinforced Thermal Silicone Sheet (1200A Series)

CHARACTERISTICS

  • Thermal conductivity: 1.50 W/mk
  • Thermal impedance: 0.512°C in sq/W
  • Thin and strong, good mechanical integrity
  • Non-tacky
  • Easy to work with and good dimensional structure
  • It has good dimensional stability even after die-cut

 

APPLICATIONS

  • Used as a thermal interphase layer, which requires high mounting pressure

 

MATERIALS AVAILABLE

  • LL-1200A-023 (0.23mm)
  • LL-1200A-030 (0.30mm)
  • LL-1200A-045 (0.45mm)
  • LL-1200A-027D (0.27mm, single side acrylic adhesive)
  • LL-1200A-034D (0.34mm, single side acrylic adhesive)
  • LL-1200A-049D (0.49mm, single side acrylic adhesive)
Fiberglass Reinforced Thermal Silicone Sheet (1200B Series)

CHARACTERISTICS

  • Thermal conductivity: 1.00 W/mk
  • Thermal impedance: 0.579°C in sq/W
  • Thin and strong, good mechanical integrity
  • Non-tacky
  • Easy to work with and good dimensional structure
  • It has good dimensional stability even after die-cut

 

APPLICATIONS

  • Used as a thermal interphase layer, which requires high mounting pressure

 

MATERIALS AVAILABLE

  • LL-1200B-023 (0.23mm)
  • LL-1200B-030 (0.30mm)
  • LL-1200B-045 (0.45mm)
  • LL-1200B-027D (0.27mm, single side acrylic adhesive)
  • LL-1200B-034D (0.34mm, single side acrylic adhesive)
  • LL-1200B-049D (0.49mm, single side acrylic adhesive)
Fiberglass Reinforced Thermal Silicone Sheet (1200C Series)

CHARACTERISTICS

  • Thermal conductivity: 2.00 W/mk
  • Thermal impedance: 0.385°C in sq/W
  • Thin and strong, good mechanical integrity
  • Non-tacky
  • Easy to work with and good dimensional structure
  • It has good dimensional stability even after die-cut

 

APPLICATIONS

  • Used as a thermal interphase layer, which requires high mounting pressure

 

MATERIALS AVAILABLE

  • LL-1200C-023 (0.23mm)
  • LL-1200C-030 (0.30mm)
  • LL-1200C-045 (0.45mm)
Thermal Conductive Silicone Rubber Gap Filler

APPLICATIONS

  • Used for low mounting pressure applications
  • Electronic parts: IC, CPU, MOS, LED, M/B, PS, HEAT SINK, LCD-TV, NB, and PC
  • DDRII Module, DVD application

 

LL-866A CHARACTERISTICS

  • Low hardness Thermal Silicone Gap filler
  • Thermal conductivity: 1.50 W/mk
  • Thickness range: 0.30mm ~ 15mm

 

LL-866B CHARACTERISTICS

  • Medium hardness Thermal Silicone Gap filler
  • Thermal conductivity: 1.40 W/mk
  • Thickness range: 0.30mm ~ 15mm

 

LL-866BF CHARACTERISTICS

  • Medium hardness Thermal Silicone Gap filler
  • Thermal conductivity: 1.30 W/mk
  • Thickness range: 0.50mm ~ 15mm

 

LL-866CR CHARACTERISTICS

  • Medium hardness Thermal Silicone Gap filler
  • Thermal conductivity: 1.50 W/mk
  • Thickness range: 0.50mm ~ 6mm

 

LL-866D CHARACTERISTICS

  • Medium hardness Thermal Silicone Gap filler
  • Thermal conductivity: 1.10 W/mk
  • Thickness range: 0.30mm ~ 6mm
High Thermal Conductive Silicone Rubber Gap Filler

APPLICATIONS

  • Electronic parts: IC, CPU, MOS, LED, M/B, PS, HEAT SINK, LCD-TV, NB and PC
  • DDRII Module, DVD application

 

LL-866DF CHARACTERISTICS

  • Low hardness Thermal Silicone Gap filler
  • Thermal conductivity: 1.10 W/mk
  • Thickness range: 0.50mm ~ 6mm

 

LL-866D-20 CHARACTERISTICS

  • Medium hardness Thermal Silicone Gap filler
  • Thermal conductivity: 1.10 W/mk
  • Thickness range: 0.50mm ~ 6mm

 

LL-866GF CHARACTERISTICS

  • Medium hardness Thermal Silicone Gap filler
  • Thermal conductivity: 3.00 W/mk
  • Thickness range: 0.30mm ~ 6mm

 

LL-868B CHARACTERISTICS

  • Thermal conductivity: 3.00 W/mk
  • Thickness range: 0.30mm ~ 6mm

 

LL-868BF CHARACTERISTICS

  • Thermal conductivity: 3.00 W/mk
  • Thickness range: 0.30mm ~ 6mm

 

LL-868BR CHARACTERISTICS

  • Thermal conductivity: 3.00 W/mk
  • Thickness range: 0.50mm ~ 6mm

 

LL-868G CHARACTERISTICS

  • Thermal conductivity: 5.00 W/mk
  • Thickness range: 0.30mm ~ 18mm
Ultra Soft High Thermal Conductive Silicone Rubber Gap Filler

APPLICATIONS

  • Electronic parts: IC, CPU, MOS, LED, M/B, PS, HEAT SINK, LCD-TV, NB, PC
  • DDRII Module, DVD application

 

LL-866G CHARACTERISTICS

  • Ultra soft, slightly tacky
  • Thermal conductivity: 3.15 W/mk
  • Thickness range: 0.50mm ~ 8mm
Thermal Conductive Non Fiber Silicone Rubber Sheet (868NFx1 series)

CHARACTERISTICS

  • Without fiberglass reinforcement
  • Softer feel and is an excellent gap filler
  • Thermal conductivity: 1.00 W/mk
  • Good electrical insulation
  • Excellent thermal conductivity and flame retardant

 

APPLICATIONS

  • Electronic components IC, CPU, mobile devices, computing devices

 

MATERIALS AVAILABLE

  • LL-868NFX1-023 (0.23mm)
  • LL-868NFX1-030 (0.30mm)
  • LL-868NFX1-045 (0.45mm)
Thermal Conductive Non Fiber Silicone Rubber Sheet (868NFx2 series)

CHARACTERISTICS

  • Without fiberglass reinforcement
  • Softer feel and is an excellent gap filler
  • Thermal conductivity: 2.00 W/mk
  • Good electrical insulation
  • Excellent thermal conductivity and flame retardant

 

APPLICATIONS

  • Electronic components IC, CPU, mobile devices, computing devices

 

MATERIALS AVAILABLE

  • LL-868NFX2-023 (0.23mm)
  • LL-868NFX2-030 (0.30mm)
  • LL-868NFX2-045 (0.45mm)
Thermal Spreaders

CHARACTERISTICS

  • Graphite-infused polymer lined with metal carrier
  • Excellent mechanical integrity
  • Easy to work with
  • Surface conduction up to 150 W/mk
  • Thickness range: 0.08mm, 0.15mm, 0.18mm, 0.20mm

 

APPLICATIONS

  • Removes heat away from hot surfaces. Requires airflow gap

Click on image to request for our
Thermal sample catalogue.